Thermaltake TG-30 Premium CPU/GPU Heatsink Thermal Compound (conductivity of 4.5 W/m-k)

Availability: 1000 in stock

[Performance Compound] Contains diamond powder for higher heat transfer providing a thermal conductivity of 4.5 W/m-k.
[All-In-One Application Kit] Includes tools to clean. prep. and install fresh thermal compound to your hardware.
[Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application. providing a neat and well-covered CPU.
[Sustainability and Safety] The TG-30 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking

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